This paper presents an investigation of crosstalk issues for coupled heterogeneous coaxial through silicon vias (HCTSVs) in ternary logic. Crosstalk issues are investigated for coupled HCTSVs using Cu-MWCNT as a conductive filler and polymer liners such as polyimide. polypropylene carbonate (PPC). and benzocyclobutene (BCB) as insulating materials. https://www.diwalishare.com/product-category/futurama-vinyl-figures/